XYT™ Lapping Film For Semiconductor

XYT™ Lapping Film Used for Semiconductor wafer (gallium arsenide, indium phosphide etc.),silicon wafer used in Solar cells

XYT™ Lapping Film for Semiconductor Applications

XYT™ Lapping Film is engineered to meet the stringent demands of the semiconductor industry, where precision surface finishing is critical for device performance and reliability. This high-precision film utilizes micron-graded abrasives bonded to a durable polyester backing, ensuring consistent material removal and a defect-free finish.

Key Features:

1. Precision Micron-graded Abrasives

   • Available in Diamond, Silicon Carbide, and Aluminum Oxide variants, the abrasive particles are precisely graded to deliver uniform and repeatable surface finishing, crucial for semiconductor wafer and component processing.

2. Superior Surface Control

   • XYT™ Lapping Film provides controlled material removal, enabling sub-micron surface finishes essential for advanced semiconductor devices. It minimizes surface roughness while maintaining planarity.

3. Durable Polyester Backing

   • The film is constructed with a high-strength polyester backing, providing superior durability and dimensional stability for uniform processing across large wafers and delicate semiconductor materials.

4. Customizable Grades & Formats

   • Available in various grit sizes (from 0.01µm to 60µm), XYT™ Lapping Film is suitable for different stages of semiconductor polishing.
   • Comes in sheets, discs, and rolls, with options for pressure-sensitive adhesive (PSA) backing for ease of use in automation systems.

Applications in the Semiconductor Industry:

• Wafer Processing & Planarization
  • Used for CMP (Chemical Mechanical Polishing) pre-processing, thinning silicon wafers, and ensuring ultra-smooth surfaces for lithography.
• IC & MEMS Device Manufacturing
  • Critical for lapping and polishing integrated circuit (IC) components, MEMS (Micro-Electro-Mechanical Systems), and advanced semiconductor substrates.
• Compound Semiconductor Finishing
  • Suitable for polishing silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), and sapphire substrates, which are widely used in power electronics and optoelectronics.
• Hard Mask and Photomask Polishing
  • Ensures defect-free surfaces on photomasks, glass, and quartz components for precision lithography in semiconductor fabrication.

Benefits:

✔ Consistent and repeatable performance for high-yield semiconductor production.
✔ Optimized material removal rates with minimal surface defects.
✔ High adaptability for advanced semiconductor processing applications.
✔ Reduced downtime and cost efficiency, as the durable film extends polishing tool life.

Conclusion

XYT™ Lapping Film is an essential solution for semiconductor wafer and device manufacturing, offering precision, reliability, and high-quality finishing. Whether in wafer planarization, CMP pre-polishing, or compound semiconductor processing, XYT™ ensures superior surface preparation, enabling the next generation of semiconductor advancements.

For specific grades and customization options, contact sales@xytbrands.com