Lapping Film in Advanced Semiconductor Manufacturing: A Comprehensive Guide

Introduction

With the rapid development of the semiconductor industry, the demand for higher precision and smaller electronic devices has increased. Achieving nanometer-level flatness on the surface of semiconductor wafers is crucial. Traditional planarization techniques, such as heat flow, rotating glass, etch back, and selective deposition methods, only offer local planarization and fail to achieve global flatness. Chemical mechanical polishing (CMP) technology, however, has revolutionized the industry by providing both global and local planarization of wafer surfaces.

The Role of Chemical Mechanical Polishing (CMP)

CMP is a critical process in semiconductor manufacturing that combines chemical and mechanical techniques to flatten uneven areas on wafer surfaces. It allows chipmakers to continue reducing circuit sizes and enhancing lithography tool performance. Since its adoption by IBM for 4MDRAM chip manufacturing in 1988, CMP has become indispensable in the integrated circuit manufacturing process. The miniaturization of device characteristic dimensions and the emergence of multi-layer wiring and new materials have further solidified the importance of CMP technology.

Market Growth and Industry Chain

According to SEMI data, the global CMP polishing materials market grew from $1.57 billion in 2014 to $2.48 billion in 2020, with a compound annual growth rate (CAGR) of approximately 8%. In China, the market reached around 3.2 billion yuan in 2020, with a CAGR of about 10% over the past five years.

CMP polishing materials form the upstream segment of the industry chain, with midstream involving wafer processing and chip manufacturing, and downstream including applications in computers, communications, automotive electronics, industrial control, and medical care. The core materials in CMP processes are polishing fluids and polishing pads, accounting for 49% and 33% of the value respectively. As technology nodes advance, such as 14nm, 10nm, 7nm, and 5nm, CMP faces greater challenges, demanding higher technical requirements for polishing materials.

Key Components in CMP: Polishing Fluid and Polishing Pads

Polishing Fluid

Polishing fluid is a critical component in CMP, accounting for 3-4% of the entire semiconductor materials market. It is a water-soluble agent that provides polishing, lubrication, and cooling. The performance of the polishing fluid directly impacts the quality of the processed surface and the efficiency of the CMP process. Major global suppliers like Cabot, Hitachi, and Fujimi dominate the market, but the demand for localized production is increasing. Anji Microelectronics is a leading Chinese supplier that has made significant strides in this field.

Polishing Pads

Polishing pads store and transport the polishing fluid, apply pressure to the silicon wafer, and mechanically rub the surface. They are essential in determining surface quality. Polishing pads are continuously consumed during the process, making their service life and defect rate crucial technical indicators. Dow Chemical monopolizes 79% of the global market, with other significant players including 3M, XYT, Cabot, and Toray. In China, companies like XYT Co. have emerged as key players, especially after acquiring Shilifu.

Lapping Films: Versatile Tools for Precision Manufacturing

Lapping films are thin, flexible backings coated with abrasive particles such as diamond, aluminum oxide, silicon carbide, or cerium oxide. They are essential in precision manufacturing and finishing, offering consistent and precise results across various industries.

Types of Lapping Films

1. Diamond Lapping Film: Known for its hardness and durability, suitable for ceramics, carbides, and hard metals.
2. Aluminum Oxide Lapping Film: Ideal for softer materials like glass, plastics, and metals.
3. Silicon Carbide Lapping Film: Best for hard and brittle materials such as ceramics and glass.
4. Cerium Oxide Lapping Film: Primarily used for polishing optical components like lenses and mirrors.

Benefits of Using Lapping Film

• Precision and Consistency: Ensures uniform finishes and tight tolerances.
• Versatility: Applicable to a wide range of materials and available in various grit sizes and backing types.
• Extended Tool Life: Maintains the sharpness and accuracy of cutting tools, reducing replacement costs.
• Cost-effectiveness: Durable and flexible, providing long-term cost savings.

Applications of Lapping Film

• Electronics Industry: Polishing semiconductor wafers, connectors, and PCBs.
• Automotive Industry: Finishing engine components like valves, gears, and bearings.
• Aerospace Industry: Polishing critical components such as turbine blades and gears.
• Medical Industry: Polishing medical devices, surgical instruments, and implants.
• Precision Engineering: Manufacturing optical components, precision bearings, and high-precision molds.

Selection Tips and Maintenance

Selecting the appropriate lapping film depends on the material, desired finish, and required precision. Consider the abrasive type, grit size, and backing type. Proper usage and maintenance include cleaning the workpiece and film, applying even pressure, replacing worn films, and storing them in a clean, dry environment.

Conclusion

Lapping films are integral to achieving high precision and surface finish in various industries. By understanding their types, benefits, and applications, you can select the right film for your needs. Proper usage and maintenance will enhance their performance and longevity. For more information or to make a purchase, visit polishingfilm.com or contact us at sales@xytbrands.com or +8615702088819.

FAQs

1. What is lapping film used for?
   • Polishing, smoothing, and fine-tuning surfaces to achieve the required finish and precision.
2. What are the different types of lapping films?
   • Diamond, aluminum oxide, silicon carbide, and cerium oxide, each suited for specific materials and applications.
3. Can lapping film be used on any material?
   • Yes, but it's essential to choose the appropriate abrasive type and grit size based on the material and desired finish.
4. How do I choose the right lapping film for my application?
   • Consider the material, desired finish, precision, abrasive type, grit size, and backing type.
5. How do I maintain and prolong the life of my lapping film?
   • Clean the workpiece and film before use, apply even pressure, replace worn films, and store them properly.